Low-loss, low-cost, IC-to-board bondwire interconnects for millimeter-wave applications

Summary form only given, as follows. This paper presents a low-cost, low-loss solution for IC-to-board interconnects using bond wires. With an L-C-L structure to compensate the influence of bond wires, low insertion loss and high return loss can be achieved. Optimized at 60 GHz, an insertion loss of 0.1 dB is achieved for the differential connection and 0.3 dB is achieved for the single-ended connection, with additional radial stubs to compensate the influence of the ground bond wire.