• DocumentCode
    2591158
  • Title

    High sensitive structure and its fabrication process for MEMS fingerprint sensor to various fingers

  • Author

    Sato, N. ; Shigematsu, S. ; Morimura, H. ; Yano, M. ; Kudou, K. ; Kamei, T. ; Machida, K.

  • Author_Institution
    NTT Microsystem Integration Labs., NTT Corp., Kanagawa, Japan
  • fYear
    2003
  • fDate
    8-10 Dec. 2003
  • Abstract
    This paper describes a novel structure of MEMS (microelectromechanical systems) and its fabrication process on the surface of the MEMS fingerprint sensor that works as an interface between a finger and the sensor. In order to detect fingerprints, whether a finger is soft or hard, novel T-shaped protrusions are proposed. The structure was fabricated by etching a sacrificial layer on the cavity structure that has a pair of electrodes. Structural calculations and experimental measurements showed that the proposed sensor bends the electrode most efficiently. This enables fingerprint detection regardless of finger elasticity, and enhances sensitivity for various finger surface conditions.
  • Keywords
    fingerprint identification; microsensors; pressure sensors; MEMS fabrication process; MEMS fingerprint sensor; T-shaped protrusions; electrode bending; electrode cavity structure; finger elasticity; finger surface conditions; finger/sensor interface; fingerprint detection; hard finger; high sensitivity MEMS structure; microelectromechanical systems; pressure sensors; sacrificial layer etching; soft finger; Elasticity; Electrodes; Etching; Fabrication; Fingerprint recognition; Fingers; Microelectromechanical systems; Micromechanical devices; Sensor phenomena and characterization; Sensor systems;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electron Devices Meeting, 2003. IEDM '03 Technical Digest. IEEE International
  • Conference_Location
    Washington, DC, USA
  • Print_ISBN
    0-7803-7872-5
  • Type

    conf

  • DOI
    10.1109/IEDM.2003.1269394
  • Filename
    1269394