• DocumentCode
    2591348
  • Title

    Development of products embedded disassembly process based on end-of-life strategies

  • Author

    Masui, Keijiro ; Mizuhara, Kiyoshi ; Ishii, Kosuke ; Rose, Catherine M.

  • Author_Institution
    Mech. Eng. Lab., MITI, Ibaraki, Japan
  • fYear
    1999
  • fDate
    1-3 Feb 1999
  • Firstpage
    570
  • Lastpage
    575
  • Abstract
    This paper surveys end-of-life strategies currently used in the electronics and appliances industries and identifies product characteristics that define feasible end-of-life strategies. The authors´ survey indicates that two key characteristics serve as factors to categorize appropriate products´ end-of-life path: product life and technology cycle. The categorization leads to a methodology that guides product developers to specify, end-of-life strategies, to seek environmentally friendly designs, and to identify opportunities for developing new recycling technologies. The goal of disassembly differs depending an each product category, however, efficient disassembly is a key to carry out the ideal end-of-life strategies for every product category. To enhance disassemblability, the authors propose the concept of the product embedded disassembly process. The fundamental idea is to embed a separation feature inside a product during manufacturing and activate it at disassembly
  • Keywords
    design for environment; product development; recycling; appliances industry; categorization; electronics industry; end-of-life strategies; environmentally friendly designs; manufacturing; product characteristics; product life; products embedded disassembly process; separation feature; technology cycle; Europe; Laboratories; Mechanical engineering; Network address translation; Pulp manufacturing; Reactive power; Virtual manufacturing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Environmentally Conscious Design and Inverse Manufacturing, 1999. Proceedings. EcoDesign '99: First International Symposium On
  • Conference_Location
    Tokyo
  • Print_ISBN
    0-7695-0007-2
  • Type

    conf

  • DOI
    10.1109/ECODIM.1999.747676
  • Filename
    747676