A novel manufacturing process for capacitors using offset lithography

Author

Harrey, P.M. ; Evans, P.S.A. ; Ramsey, B.J. ; Harrison, D.

Author_Institution

Dept. of Design, Brunel Univ., Egham, UK

fYear

1999

fDate

1-3 Feb 1999

Firstpage

842

Lastpage

846

Abstract

A novel fabrication technique for passive electronic components and circuit interconnects based on offset lithographic printing is described. The application of this work is in low cost and low environmental impact substitutes for resin-laminate circuit boards populated with discrete components. Multilayer ceramic capacitor elements are formed on flexible substrates by depositing layers of metal and ceramic-loaded inks sequentially via a standard lithographic printing press

Keywords

ceramic capacitors; lithography; printed circuit manufacture; thick film capacitors; ceramic-loaded inks deposition; circuit interconnects; conductive inks; dielectric inks; fabrication technique; flexible substrates; low cost; low environmental impact; manufacturing process; metal layers deposition; multilayer ceramic capacitor elements; offset lithographic printing; offset lithography; passive electronic components; printed capacitors; thick film capacitors; Capacitors; Ceramics; Costs; Electronic components; Fabrication; Flexible printed circuits; Integrated circuit interconnections; Manufacturing processes; Nonhomogeneous media; Printing;

fLanguage

English

Publisher

ieee

Conference_Titel

Environmentally Conscious Design and Inverse Manufacturing, 1999. Proceedings. EcoDesign '99: First International Symposium On

Conference_Location

Tokyo

Print_ISBN

0-7695-0007-2

Type

conf

DOI

10.1109/ECODIM.1999.747726

Filename

747726