• DocumentCode
    2594644
  • Title

    Development of Quantitative Evaluation of Copper Sulfide Deposition on Insulating Paper

  • Author

    Kawarai, H. ; Fujita, Y. ; Tanimura, J. ; Toyama, S. ; Yamada, N. ; Nagao, E. ; Amimoto, T.

  • Author_Institution
    Mitsubishi Electr. Corp., Amagasaki
  • fYear
    2008
  • fDate
    26-29 Oct. 2008
  • Firstpage
    313
  • Lastpage
    316
  • Abstract
    We have developed a new heating test to investigate the influence of dissolved copper and oxygen on the copper sulfide generation in alkyl benzene insulating oil with dibenzyl disulfide (DBDS) added. The weight of the deposited and dissolved copper was systematically studied in atmospheres of nitrogen and artificial air. The copper sulfide deposition on the insulating paper originated from the dissolved copper (copper complex compound) in the insulating oil. The weight of the copper deposited on the insulating paper was increased by the existence of oxygen. The acceleration effect on copper sulfide deposition on insulating paper was clarified for the first time by strictly controlling the experimental atmosphere. Moreover, the influence of the existence of oxygen was investigated individually on insulating oil and insulating paper. The oxidation of both alkyl benzene and insulating paper was found to accelerate copper sulfide generation.
  • Keywords
    copper compounds; heating; insulating materials; insulating oils; alkyl benzene insulating oil; copper sulfide deposition; dibenzyl disulfide; heating test; insulating paper; quantitative evaluation; Atmosphere; Copper; Dielectrics and electrical insulation; Heating; Nitrogen; Oil insulation; Petroleum; Power transformer insulation; Strips; Testing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Insulation and Dielectric Phenomena, 2008. CEIDP 2008. Annual Report Conference on
  • Conference_Location
    Quebec, QC
  • Print_ISBN
    978-1-4244-2548-8
  • Electronic_ISBN
    978-1-4244-2549-5
  • Type

    conf

  • DOI
    10.1109/CEIDP.2008.4772810
  • Filename
    4772810