Degradation of signal integrity due to package-common-mode resonance caused by external conductive noise in power supply system

Package-common-mode resonance which is caused by a parasitic capacitance and a parasitic inductance between package and PCB grounds degrades signal and power integrity. A parasitic capacitance between a package ground and a PCB ground resonates with a parasitic inductance at ground connections, such as solder balls in a BGA package. In this paper, the authors simulate ground bounce due to the package-common-mode resonance caused by external conductive noise in a power supply system. The ground bounce degrades signal integrity of CMOS output signal. The authors demonstrated an increase in jitter of CMOS output at the package-common-mode resonance frequency.