Thermal qualification of 3D stacked die packages

In this paper measurement experiments prove that the structure function evaluation of the thermal transient testing is capable to locate die attach failure(s), even in case of stacked die packages. Both the strength and the location of the die attach failure may be determined with the methodology of a fast thermal transient measurement and the subsequent computer evaluation. The paper summarizes shortly the theoretical background of the method, and presents the use of the methodology with several measured examples. With the help of the presented correction procedure even the accurate values of the thermal layer parameters, such as thermal resistances or capacitances may be determined with the discussed thermal qualification methodology.