• DocumentCode
    2597185
  • Title

    Transient characteristics of BCB encapsulated surface micromachined aluminum micro-mechanical resonators

  • Author

    Pamidighantam, Sudhakar

  • Author_Institution
    Indian Inst. of Sci., Supercomput. Educ. & Res. Center, Bangalore, India
  • fYear
    2004
  • fDate
    8-10 Dec. 2004
  • Firstpage
    177
  • Lastpage
    182
  • Abstract
    In this contribution, the transient characteristics of benzo cyclo butene (BCB) encapsulated aluminum (Al) micro mechanical resonators as a function of time varying pressure are studied. The quality factor of encapsulated Al resonator showed a drastic change with time of more than 200% reduction. The estimated transient leak rate spans over several orders of magnitude (105 to 10-9 atm cm3 s-1). A theoretical description of Al micro mechanical resonator and the leak rate are presented. Possible causes for the leak rate and the potential solutions are also outlined.
  • Keywords
    aluminium; encapsulation; micromachining; micromechanical resonators; surface treatment; transient analysis; Al; benzo cyclo butene; encapsulated Al resonator; micromachined Aluminium resonator; time varying pressure; transient characteristics; transient leak rate; Aluminum; Artificial intelligence; Electronic components; Electronics packaging; Microelectromechanical devices; Micromechanical devices; Q factor; Radiofrequency microelectromechanical systems; Supercomputers; Testing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics Packaging Technology Conference, 2004. EPTC 2004. Proceedings of 6th
  • Print_ISBN
    0-7803-8821-6
  • Type

    conf

  • DOI
    10.1109/EPTC.2004.1396599
  • Filename
    1396599