• DocumentCode
    2597207
  • Title

    Hybrid integration of LiNbO3 thin films on micromachined Si substrates using room-temperature transfer bonding

  • Author

    Takigawa, R. ; Higurashi, E. ; Suga, T. ; Kawanishi, T.

  • Author_Institution
    Sch. of Eng., Univ. of Tokyo, Tokyo, Japan
  • fYear
    2012
  • fDate
    22-23 May 2012
  • Firstpage
    105
  • Lastpage
    105
  • Abstract
    Summary form only given. Hybrid integration of high-quality lithium niobate (LiNbO3) single-crystal thin films (<; 5 μm) on micromachined Si substrates has been demonstrated using room-temperature flip-chip transfer bonding based on surface-activated bonding with Au microbumps.
  • Keywords
    bonding processes; flip-chip devices; integration; lithium compounds; micromachining; thin films; LiNbO3; Si; flip-chip transfer bonding; high-quality single-crystal thin film integration; microbump; micromachining; surface-activated bonding; Bonding; Flip chip; Gold; Lithium niobate; Optical films; Silicon; Substrates;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Low Temperature Bonding for 3D Integration (LTB-3D), 2012 3rd IEEE International Workshop on
  • Conference_Location
    Tokyo
  • Print_ISBN
    978-1-4673-0743-7
  • Type

    conf

  • DOI
    10.1109/LTB-3D.2012.6238064
  • Filename
    6238064
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2597207