DocumentCode
2597411
Title
Temporary-bonding and LowTemp® debonding technology for various applications
Author
Kawano, Masaya ; Komatsu, Takumi ; Fehkührer, Andreas ; Schachinger, Maria ; Wiesbauer, Harald ; Burggraf, Jürgen ; Burgstaller, Daniel ; Matthias, Thorsten ; Wimplinger, Markus ; Lindner, Paul
Author_Institution
EV Group Japan K.K., Yokohama, Japan
fYear
2012
fDate
22-23 May 2012
Firstpage
149
Lastpage
149
Abstract
A standard TB/DB technology capable of wide-range of adhesives is strongly required for various TB/DB applications. Maximum temperature of backside process was investigated for 5 kinds of adhesives. ZoneBOND™ technology has been demonstrated to have much flexibility in adhesives, resulting applicable to various applications.
Keywords
adhesive bonding; LowTemp debonding technology; TB/DB technology; ZoneBOND technology; adhesives; backside process; temporary-bonding technology; Bonding; High temperature superconductors; Standards; Temperature dependence; Thermal stability; USA Councils;
fLanguage
English
Publisher
ieee
Conference_Titel
Low Temperature Bonding for 3D Integration (LTB-3D), 2012 3rd IEEE International Workshop on
Conference_Location
Tokyo
Print_ISBN
978-1-4673-0743-7
Type
conf
DOI
10.1109/LTB-3D.2012.6238074
Filename
6238074
Link To Document