• DocumentCode
    2598959
  • Title

    Small form factor and low profile quad-band System-in-Package (SiP) module

  • Author

    Shevelov, M. ; Sieroshtan, V. ; Ruban, O. ; Burygin, A. ; Komakha, P. ; Aleksieiev, O. ; Chayka, O. ; Sevskiy, G. ; Stoehr, P. ; Heide, P. ; Vossiek, Martin

  • Author_Institution
    Epcos AG (TDK-EPC), Munich, Germany
  • fYear
    2011
  • fDate
    5-10 June 2011
  • Firstpage
    1
  • Lastpage
    1
  • Abstract
    Summary form only given, as follows. A very small form factor and low profile quad-band System-in-Package (SiP) module based on the state-of-the-art 65nm CMOS IC is presented. The SiP module provides full function of 2.4G and 5G WLAN, Bluetooth, GPS, FM radio and FM transmitter. The highly integrated device incorporates single chip, RF front-end module, filters for WLAN and GPS, number of SMD components and EMI shielding. Very compact SiP solution (9.5×11.9×1.2mm3) forms a complete multi-functional wireless communication system.
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microwave Symposium Digest (MTT), 2011 IEEE MTT-S International
  • Conference_Location
    Baltimore, MD
  • ISSN
    0149-645X
  • Print_ISBN
    978-1-61284-754-2
  • Electronic_ISBN
    0149-645X
  • Type

    conf

  • DOI
    10.1109/MWSYM.2011.5973562
  • Filename
    5973562
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2598959