Design and Process Contribution to Inherent Failure Mechanisms of Microminlature Electronic Components for Minuteman II

High-stress testing of 200,000 microminiature components used on Minuteman II, and subsequent analyses of failures, have demonstrated deficiencies in design and processing of these microminiature components. These tests and analyses were made during the course of the Component Quality Assurance and Component Evaluation Programs conducted by Autonetics. A summary of these results is given. It provides criteria for establishment of designs and processes for microminiature transistors, diodes, capacitors, resistors and integrated circuits. Solutions for demonstrated deficiencies are identified and catagorixed in terms of design improvement, process and tool changes, inspection changes, and screens. The role of component procurement documents and component qualification procedures in the assurance of proper design and processing of high reliability microminiature components is discussed. The effectiveness of these procedures in elimination of design and process inherent failure mechanisms is shown.