• DocumentCode
    26007
  • Title

    Verification of Snapback Model by Transient I-V Measurement for Circuit Simulation of ESD Response

  • Author

    Kuo-Hsuan Meng ; Rosenbaum, Elyse

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Univ. of Illinois at Urbana-Champaign, Urbana, IL, USA
  • Volume
    13
  • Issue
    2
  • fYear
    2013
  • fDate
    Jun-13
  • Firstpage
    371
  • Lastpage
    378
  • Abstract
    It is demonstrated that if the compact model of a snapback-type device is calibrated using only pulsed I-V data, it may not correctly reproduce the device response to arbitrary electrostatic discharge (ESD) waveforms. Transient I-V measurements are demonstrated to improve the completeness of the device characterization and model verification. Given an accurately calibrated ESD compact model, circuit simulations may be used to identify device-tester interactions that have been reported to cause unexpected damage during ESD testing. The interaction between a snapback device and an ESD tester can be understood in the context of a relaxation oscillator.
  • Keywords
    MOSFET; circuit simulation; electrostatic discharge; relaxation oscillators; semiconductor device models; semiconductor device reliability; transients; ESD response; ESD testing; circuit simulations; device tester interactions; electrostatic discharge; model verification; relaxation oscillator; snapback model; transient I -V measurement; Circuit simulation; electrostatic discharge (ESD); metal–oxide–semiconductor (MOS) model; reliability;
  • fLanguage
    English
  • Journal_Title
    Device and Materials Reliability, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1530-4388
  • Type

    jour

  • DOI
    10.1109/TDMR.2013.2258672
  • Filename
    6504488