• DocumentCode
    2600760
  • Title

    Microelectronics technology and packaging

  • fYear
    2008
  • fDate
    19-21 June 2008
  • Firstpage
    461
  • Lastpage
    462
  • Abstract
    Start of the above-titled section of the conference proceedings record.
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Mixed Design of Integrated Circuits and Systems, 2008. MIXDES 2008. 15th International Conference on
  • Conference_Location
    Poznan, Poland
  • Print_ISBN
    978-83-922632-7-2
  • Type

    conf

  • Filename
    4600959
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2600760