DocumentCode
2600813
Title
Thermal Evaluations of Diffused-Junction Semiconductors
Author
Delaney, R.A.
Author_Institution
IBM, East Fishkill, New York
fYear
1967
fDate
Nov. 1967
Firstpage
106
Lastpage
107
Abstract
This method consists of two parts: (1) determination of thermal resistance from the diffused junction to a thermal reference plane through the use of the diode equation relation; and (2) the thermal resistance from the diffused junction to the joining pad and the thermal resistance from the pad at the substrate surface to the substrate bottom using a thick film cobalt oxide thermistor.
Keywords
Cobalt; Current measurement; Equations; Heat sinks; Substrates; Surface resistance; Temperature; Thermal resistance; Thermistors; Thick films;
fLanguage
English
Publisher
ieee
Conference_Titel
Reliability Physics Symposium, 1967. Sixth Annual
Conference_Location
Los Angeles, CA, USA
ISSN
0735-0791
Type
conf
DOI
10.1109/IRPS.1967.362400
Filename
4207763
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