• DocumentCode
    2603105
  • Title

    Macromodeling based variability analysis of an inverted embedded microstrip line

  • Author

    Vante Ginste, Dries ; De Zutter, Daniel ; Deschrijver, Dirk ; Dhaene, Tom ; Canavero, Flavio

  • Author_Institution
    Dept. of Inf. Technol., Ghent Univ., Ghent, Belgium
  • fYear
    2011
  • fDate
    23-26 Oct. 2011
  • Firstpage
    153
  • Lastpage
    156
  • Abstract
    A multivariate macromodel of the per unit length parameters of an inverted embedded microstrip line is built starting from a limited number of highly accurate but computationally expensive electromagnetic simulations. Besides the frequency dependency, the macromodel also encompasses the influence of a geometrical parameter that determines the shape of the cross-section of the metallic interconnect. This allows to assess the influence of the etching process through a variability analysis of the interconnect´s behavior in both frequency and time domain. The analysis is carried out via a robust Monte Carlo approach, which has been made computationally feasible thanks to the macromodeling step.
  • Keywords
    Monte Carlo methods; embedded systems; etching; frequency-domain analysis; integrated circuit interconnections; microstrip lines; time-domain analysis; computationally expensive electromagnetic simulations; computationally feasible; etching process; frequency dependency; frequency domain; geometrical parameter; inverted embedded microstrip line; macromodeling based variability analysis; macromodeling step; metallic interconnect; multivariate macromodel; robust Monte Carlo approach; time domain; Computational modeling; Etching; Frequency domain analysis; Integrated circuit interconnections; Microstrip; Robustness; Transfer functions;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Performance of Electronic Packaging and Systems (EPEPS), 2011 IEEE 20th Conference on
  • Conference_Location
    San Jose, CA
  • ISSN
    pending
  • Print_ISBN
    978-1-4244-9398-2
  • Electronic_ISBN
    pending
  • Type

    conf

  • DOI
    10.1109/EPEPS.2011.6100213
  • Filename
    6100213