DocumentCode
2603840
Title
Package Hermeticity
Author
Adams, George E.
Author_Institution
Motorola Integrated Circuit Center, Mesa, Arizona
fYear
1973
fDate
26755
Firstpage
95
Lastpage
97
Abstract
Typical semiconductor users do not perform failure analysis on what they feel are package hermeticity problems. They usually draw their conclusions from standard fine and gross tests which may be inaccurate. The following discussion portrays methods of verifying hermeticity integrity.
Keywords
Circuit testing; Electronic equipment testing; Failure analysis; Integrated circuit packaging; Integrated circuit testing; Nondestructive testing; Performance analysis; Performance evaluation; Semiconductor device packaging; Semiconductor device testing;
fLanguage
English
Publisher
ieee
Conference_Titel
Reliability Physics Symposium, 1973. 11th Annual
Conference_Location
Las Vegas, NV, USA
ISSN
0735-0791
Type
conf
DOI
10.1109/IRPS.1973.362577
Filename
4207952
Link To Document