DocumentCode
2604038
Title
Avalanche Breakdown in Polycrystalline Silicon Films
Author
Neugebauer, C.A. ; Burgess, J.F. ; Joynson, R.E. ; Mundy, J.L
Author_Institution
General Electric Corporate Research and Development, Schenectady, New York 12301
fYear
1973
fDate
26755
Firstpage
163
Lastpage
169
Abstract
Electrons can flow from the field plate of a silicon gate MOS, through the gate oxide, to the contacts or the channel, if the field plate is brought into avalanche. This leads to shifts in the transistor threshold voltage, and premature discharge of floating nodes. The characteristics of p-type polycrystalline silicon films in MOS avalanche have been examined. Avalanche injected electron currents in the gate oxide up to 1 mA/cm2 have been measured at 500 KHz. Trapping of electrons occurs at a distance of 100 Ã
from the oxide interface, and appears to depend strongly on the boron content of the gate oxide.
Keywords
Avalanche breakdown; Breakdown voltage; Current measurement; Doping; Electron traps; Lead compounds; MOS capacitors; Plasma accelerators; Semiconductor films; Silicon;
fLanguage
English
Publisher
ieee
Conference_Titel
Reliability Physics Symposium, 1973. 11th Annual
Conference_Location
Las Vegas, NV, USA
ISSN
0735-0791
Type
conf
DOI
10.1109/IRPS.1973.362589
Filename
4207964
Link To Document