DocumentCode
2605078
Title
Degradation of Gold-Germanium Ohmic Contact to n-GaAs
Author
Ohata, K. ; Ogawa, M.
Author_Institution
Central Research Laboratories, Nippon Electric Company Ltd., 1753 Shimonumabe, Nakahara-ku, Kawasaki, Japan
fYear
1974
fDate
27120
Firstpage
278
Lastpage
283
Abstract
The metallurgical and electrical investigations were carried out on the Pt/Au-Ge and Ni/Au-Ge ohmic contacts to n-GaAs in focusing the degradation during aging. The characteristic structures in the alloyed regions and their metallurgical changes during aging (330°C) were examined by means of Electron Probe Micro-Analysis. The thick Pt and Ni films in the contact systems caused the reaction during aging to proceed. The degradation of the contact resistance during aging was found to take place with the progress of the metallurgical reaction. The details of the investigation including the discussions on the degradation mechanism will be described.
Keywords
Aging; Alloying; Degradation; Electrons; Gallium arsenide; Gold alloys; Nickel alloys; Ohmic contacts; Probes; Substrates;
fLanguage
English
Publisher
ieee
Conference_Titel
Reliability Physics Symposium, 1974. 12th Annual
Conference_Location
Las Vegas, NV, USA
ISSN
0735-0791
Type
conf
DOI
10.1109/IRPS.1974.362658
Filename
4208036
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