• DocumentCode
    2605539
  • Title

    Electromigration Failure in Au Thin-Film Conductors

  • Author

    Agarwala, Birendra N.

  • Author_Institution
    International Business Machines Corp., Poughkeepsie, N. Y. 12602
  • fYear
    1975
  • fDate
    27485
  • Firstpage
    107
  • Lastpage
    112
  • Abstract
    Experiments are carried out to understand the electromigration-induced failure mechanism in thin-film Au conductors. The activation energy for the atom transport and the magnitude of the current exponent In the failure equation are obtained. The role of surface coverage on the reliability of AU stripes is studied. The underlying mode of atom transport and the possible sources of flux divergences are discussed in terms of these results.
  • Keywords
    Atomic measurements; Conductive films; Conductors; Current density; Electromigration; Equations; Gold; Substrates; Temperature distribution; Transistors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Reliability Physics Symposium, 1975. 13th Annual
  • Conference_Location
    Las Vegas, NV, USA
  • ISSN
    0735-0791
  • Type

    conf

  • DOI
    10.1109/IRPS.1975.362683
  • Filename
    4208064
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2605539