Effects of gold on the properties of tin-antimony solder in flip-chip-pin-grid-array (FCGPA) packages

Author

Kee, See Bee ; Hussain, Luay B. ; Khong, YL ; Kumar, D.C.P.

Author_Institution

Sch. of Mater. & Miner. Resources Eng., Univ. of Sci. Malaysia, Malaysia

fYear

2003

fDate

10-12 Dec. 2003

Firstpage

77

Lastpage

80

Abstract

The physical characteristics of the tin-antimony solder used in FCPGA semiconductor packages change with the diffusion of gold from the gold plated layers in the solder pads or pin. This must be considered in the setting of parameters for the subsequent re-flow processes and also the possible impact on the quality and reliability of the joints. This work describes the physical and micro-structural properties of the 95Sn5Sb parent material alloyed with 1.0, 2.0, 2.5, 3.0, 3.5, 4.0 and 5.0 wt% of gold. In particular, the melting behaviour, electrical and thermal conductivity and hardness of 95Sn5Sb solder doped with gold are discussed.

Keywords

antimony alloys; chemical interdiffusion; circuit reliability; electrical conductivity; flip-chip devices; gold; hardness; reflow soldering; semiconductor device packaging; solders; thermal conductivity; tin alloys; SnSb-Au; electrical conductivity; flip-chip-pin-grid-array; gold diffusion effects; hardness; joint reliability; liquidus temperatures; melting; microelectronic packaging; microstructure; reflow processes; semiconductor packages; solder physical characteristics; solidus temperatures; thermal conductivity; Conducting materials; Electronic packaging thermal management; Gold; Materials science and technology; Nickel; Pins; Temperature; Testing; Thermal conductivity; Tin;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Packaging Technology, 2003 5th Conference (EPTC 2003)

Print_ISBN

0-7803-8205-6

Type

conf

DOI

10.1109/EPTC.2003.1271494

Filename

1271494