• DocumentCode
    2607266
  • Title

    Shell-based simplified electronic package model development and its application for reliability analysis

  • Author

    Ren, Wei ; Wang, Jianjun

  • Author_Institution
    NOKIA, Irving, TX, USA
  • fYear
    2003
  • fDate
    10-12 Dec. 2003
  • Firstpage
    217
  • Lastpage
    222
  • Abstract
    In this paper, the procedures for generating beam-shell-based simplified PWB assembly models using both the ANSYS parametric APDL format and ABAQUS input data files have been developed. The simulation results from the beam-shell-based simplified PWB assembly model were compared with its corresponding 3D detailed solid PWB assembly model under various loading conditions including thermo-mechanical load, mechanical (bending) load and drop load. The results show that the beam-shell-based simplified PWB assembly model gives a fairly good estimation in a time effective manner, over 90% time saving for the cases studied for both thermo-mechanical and mechanical (bending) loading conditions and over 80% for impact loading conditions. The uniqueness for the proposed framework is that when the beam-shell-based simplified PWB assembly model methodology is combined with the shell-to-solid submodeling technique, it can provide not only a time effective simulation procedure but also more accurate results, both in PWB assembly and phone level simulation.
  • Keywords
    circuit reliability; circuit simulation; electronics packaging; finite element analysis; impact (mechanical); printed circuits; thermal stresses; FEA model; PWB assembly model; beam-shell-based electronic package model; bending load; drop load; impact loading; phone level simulation; reliability analysis; shell-to-solid submodeling technique; thermo-mechanical load; Analytical models; Assembly; Chip scale packaging; Circuit simulation; Electronic packaging thermal management; Electronics packaging; Finite element methods; Lead; Soldering; Solid modeling;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics Packaging Technology, 2003 5th Conference (EPTC 2003)
  • Print_ISBN
    0-7803-8205-6
  • Type

    conf

  • DOI
    10.1109/EPTC.2003.1271519
  • Filename
    1271519