DocumentCode
2607408
Title
Characterization of Reaction Bonded Au and Ag Thick Film Metallizations
Author
Kossowsky, R. ; Mitchell, J.
Author_Institution
Westinghouse Research and Development Center, Pittsburgh, Pennsylvania 15235
fYear
1977
fDate
28216
Firstpage
262
Lastpage
271
Abstract
The morphologies and microstructural characteristics of Al-wire and Au-wire-bonded to reactively-bonded Au and Ag metallization were studied by SEM and microprobe analyses. The mechanisms of wire bonding in each case and-the mechanisms of the metallization to substrate bonding are discussed.
Keywords
Additives; Adhesives; Bonding; Gold; Hydrogen; Metallization; Substrates; Surface morphology; Thick films; Wire;
fLanguage
English
Publisher
ieee
Conference_Titel
Reliability Physics Symposium, 1977. 15th Annual
Conference_Location
LAs Vegas, NV, USA
ISSN
0735-0791
Type
conf
DOI
10.1109/IRPS.1977.362803
Filename
4208190
Link To Document