• DocumentCode
    2608129
  • Title

    A Reliable Dry Ceramic Dual In-Line Package (CERDIP)

  • Author

    Lowry, R.K. ; Van Leeuwen, C.J. ; Kennimer, B.L. ; Miller, L.A.

  • Author_Institution
    Harris Semiconductor, P. O. Box 883, Melbourne, Florida 32901
  • fYear
    1978
  • fDate
    28581
  • Firstpage
    207
  • Lastpage
    212
  • Abstract
    The ceramic DIP package utilizing low temperature (~500°C) sealing glasses has been simultaneously widely deployed for packaging IC´s and condemned for many high reliability applications because of high, moisture content in the sealed cavity. This paper describes the construction, characteristics, and reliability performance of a volume producible, cost-effective Cerdip which has a sealed moisture content typically less than 500ppmv.
  • Keywords
    Ceramics; Corrosion; Crystalline materials; Crystallization; Glass; Metallization; Moisture; Semiconductor device packaging; Temperature; Viscosity;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Reliability Physics Symposium, 1978. 16th Annual
  • Conference_Location
    San Diego, CA, USA
  • ISSN
    0735-0791
  • Type

    conf

  • DOI
    10.1109/IRPS.1978.362847
  • Filename
    4208237
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2608129