• DocumentCode
    2608229
  • Title

    Electromigration Failure Under Pulse Test Conditions

  • Author

    Miller, R.J.

  • Author_Institution
    IBM Thomas J. Watson Research Center, Yorktown Heights, New York 10598. 914-945-2665
  • fYear
    1978
  • fDate
    28581
  • Firstpage
    241
  • Lastpage
    247
  • Abstract
    Unpassivated aluminum thin-film conductors were subjected to pulsed dc currents at a frequency of 250 kHz, with duty factors ranging from 10% to 100%. Current densities of 4×106 A/cm2 and 1 × 107 A/cm2 were employed. Some tests were also performed at frequencies of 20 kHz and 100 kHz. The conductor lifetime was found to depend strongly on the pulse duty factor, with the mean time to failure, measured in on-time hours, showing a monotonic improvement as the duty factor of testing was decreased. At a pulse current density of 1 × 107 A/cm2, the results demonstrated the occurrence of electromigration in the direction of the "electron wind". A proportion of the improvement in the conductor lifetime is attributable to a decrease in the amount of conductor self-heating, particularly at a current density of 1 × 107 A/cm2; however, self-heating considerations cannot account for the entire improvement unless unusually large activation energies for grain boundary diffusion are assumed. The cause of the remainder of the improvement (not accounted for by self-heating) has not been determined; however, excess vacancy concentration, and its dependence on duty factor, may contribute to the lifetime improvement.
  • Keywords
    Aluminum; Conductive films; Conductors; Current density; Electromigration; Frequency; Performance evaluation; Pulse measurements; Testing; Transistors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Reliability Physics Symposium, 1978. 16th Annual
  • Conference_Location
    San Diego, CA, USA
  • ISSN
    0735-0791
  • Type

    conf

  • DOI
    10.1109/IRPS.1978.362853
  • Filename
    4208243