Multi resolution TLM methodology

Author

Oswal, Tikko ; Seng, Leong Mook ; Leong, Ooi Ban ; Rotaru, Mihai Dragos ; Seng, Yeo Mui

Author_Institution

Dept. of Electr. & Comput. Eng., Nat. Univ. of Singapore, Singapore

fYear

2003

fDate

10-12 Dec. 2003

Firstpage

530

Lastpage

532

Abstract

Initially modelling using Transmission line modelling method required meshes of equal size to model the power planes. However, to model power planes with small features accurately and efficiently multi-resolution power plane modelling is required. Fine meshes will model area where small features are present and coarse meshes will model area where small features are not present. In this paper, an interfacing model is derived for multi-resolution modelling by interfacing meshes of different resolution. The derived model is verified by modelling a test power plane. Results match closely till 12 GHz and peaks and s pattern nicely follow upto 20 GHz when modelled by coarse meshes of dimensions 1 mm by 1 mm and finer meshes.

Keywords

current distribution; power supply circuits; printed circuit design; transmission line theory; 2D wave propagation equation; coarse meshes; current distribution; fine meshes; interfacing model; multiresolution methodology; power planes; transmission line modelling; Boundary conditions; Coaxial components; Computational modeling; Electronic mail; Energy conservation; Energy resolution; Joining processes; Microelectronics; Power transmission lines; Testing;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Packaging Technology, 2003 5th Conference (EPTC 2003)

Print_ISBN

0-7803-8205-6

Type

conf

DOI

10.1109/EPTC.2003.1271578

Filename

1271578