• DocumentCode
    2608413
  • Title

    Dielectric Behavior of Compact Design Three Phase Coated Gas Insulated Busduct with Metallic Particle Contamination

  • Author

    Padmavathi, D. ; Kumar, G. V Nagesh ; Amarnath, J. ; Chowdary, D. Deepak

  • Author_Institution
    JB Inst. of Eng. & Technol., Hyderabad
  • fYear
    2008
  • fDate
    9-12 Nov. 2008
  • Firstpage
    399
  • Lastpage
    403
  • Abstract
    The use of a gaseous medium with higher dielectric strength like sulphur hexafluoride (SF6) instead of air helps in manifold reduction in the size of the sub-station component. Compact GIS systems are essentially three-phase common systems with more than one functional element in one enclosure. Metallic particles can be either free to move in the GIS or they may be tuck either to an energized electrode or to an insulator surface. If a metallic particle crosses the gap and comes into contact with the inner electrode or if a metallic particle adheres to the inner conductor, the particle will act as a protrusion on the surface of the electrode, and the voltage required for breakdown of the GIS will also cause a significant reduction of the breakdown voltage. One method of conducting particle control and deactivation is by coating the inner surface of the outer enclosure. To determine the particle trajectories in a three-phase common enclosure gas insulated busduct (GIB) an outer enclosure of diameter 500 mm and inner conductors of diameters 64 mm spaced equilaterally are considered. Aluminum, copper and silver particles were considered to be present on enclosure surface. Simulation of particle movement with reduced phase conductor is also carried out with a view to obtain optimum size of conductor for reliable operation by reducing the original diameter of the conductor from 64 mm to 54 mm in steps of 5 mm.
  • Keywords
    coating techniques; dielectric materials; gas insulated substations; gas insulated switchgear; SF6; aluminum particles; breakdown voltage reduction; compact design three phase coated gas insulated busduct; copper particles; dielectric behavior; insulator surface; metallic particle contamination; particle control; particle movement; phase conductor reduction; silver particles; substation component; sulphur hexafluoride; Breakdown voltage; Conductors; Contamination; Dielectric breakdown; Dielectrics and electrical insulation; Electrodes; Gas insulation; Geographic Information Systems; Metal-insulator structures; Sulfur hexafluoride; Compact Design; Gas Insulated Switchgear; Particles;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    High Voltage Engineering and Application, 2008. ICHVE 2008. International Conference on
  • Conference_Location
    Chongqing
  • Print_ISBN
    978-1-4244-3823-5
  • Electronic_ISBN
    978-1-4244-2810-6
  • Type

    conf

  • DOI
    10.1109/ICHVE.2008.4773957
  • Filename
    4773957