• DocumentCode
    2608778
  • Title

    Simulation of Particle movement in a Single Phase Isolated Gas Insulated Busduct with Image Charge Effect

  • Author

    Sahu, K. B Madhu ; Amarnath, J. ; Murthy, K. S Linga ; Singh, B.P.

  • Author_Institution
    Aditya Inst. of Technol. & Manage., Tekkali
  • fYear
    2008
  • fDate
    9-12 Nov. 2008
  • Firstpage
    466
  • Lastpage
    469
  • Abstract
    This work analyses with and without Image charge effect on metallic particle movement in a single phase GIB (Gas Insulated Busduct) and also with and without dielectric coating on the enclosure. Dielectric coating helps to improve the insulation performance. The enclosure in a GIB may be coated with a dielectric material to restore some of the dielectric strength of the compressed gas that is lost due to surface roughness and contamination with conducting particles. Under an applied AC voltage, the maximum height reached by particle in a GIB is much lower for a coated than for an uncoated enclosure. To obtain the particle trajectories, the equations describing the motion of the particle due to image charge effect has been developed in this paper. Further, the simulation has been carried out to obtain the particle trajectories at various voltages of Aluminium and Copper particles are presented and thoroughly discussed.
  • Keywords
    dielectric materials; gas insulated substations; insulator contamination; GIB; conducting particles; dielectric coating; gas insulated substation; image charge effect; particle movement; single phase isolated gas insulated busduct; surface contamination; surface roughness; Coatings; Dielectric breakdown; Dielectric materials; Dielectrics and electrical insulation; Gas insulation; Image analysis; Image restoration; Rough surfaces; Surface roughness; Voltage; Electrostatic effect; Gas Insulated Bus Duct; Gas insulated substations; Image charge effect; Metallic particles;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    High Voltage Engineering and Application, 2008. ICHVE 2008. International Conference on
  • Conference_Location
    Chongqing
  • Print_ISBN
    978-1-4244-3823-5
  • Electronic_ISBN
    978-1-4244-2810-6
  • Type

    conf

  • DOI
    10.1109/ICHVE.2008.4773974
  • Filename
    4773974