DocumentCode
2611104
Title
Electromigration, Thermal Analysis and Die Attach--A Case History
Author
Partridge, J. ; Marques, A. ; Camp, R.
Author_Institution
The Charles Stark Draper Laboratory, Inc., 555 Technology Square, Cambridge, MA 02139
fYear
1982
fDate
30011
Firstpage
34
Lastpage
44
Abstract
A case history and thermal analysis is presented to define the variables causing premature aluminum electromigration failures of integrated circuits. Major contributants are inadequate thermal die contact, manufacturing crossectional area tolerances, and obsolete design guidelines. Based on a thermal model and statistical data, a feasible screen for die thermal integrity is given as well as design considerations for ULSI.
Keywords
Aluminum; Circuit testing; Electromigration; Failure analysis; Glass; History; Life estimation; Life testing; Qualifications; Temperature;
fLanguage
English
Publisher
ieee
Conference_Titel
Reliability Physics Symposium, 1982. 20th Annual
Conference_Location
San Diego, NV, USa
ISSN
0735-0791
Type
conf
DOI
10.1109/IRPS.1982.363019
Filename
4208421
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