• DocumentCode
    2612084
  • Title

    Si nanowire device and its modeling

  • Author

    Iwai, Hiroshi ; Natori, Kenji ; Kakushima, Kuniyuki ; Ahmet, Parhat ; Oshiyama, Atsushi ; Shiraishi, Kenji ; Iwata, Jun-Ichi ; Yamada, Keisaku ; Ohmori, Kenji

  • Author_Institution
    Frontier Res. Center, Tokyo Inst. of Technol., Yokohama, Japan
  • fYear
    2010
  • fDate
    6-8 Sept. 2010
  • Firstpage
    63
  • Lastpage
    66
  • Abstract
    Because of its nature of effectively suppressing the off-leakage current with gate around configuration, the Si nanowire FET has been thought be the ultimate structure for for ultra-small CMOS devices towards their downsizing limit. Recently, several experimental data of Si nanowire FETs with very high on-current much larger than that of planar MOSFETs have been published. Thus, Si nanowire FETs are now drawing attention as the most promising candidate for the mainstream CMOS devices in 2020s. In order for the Si nanowire FETs to be introduced into integrated circuits, good compact models which circuit designers can easily handle with are essential. However, it is a really challenging task to establish the compact model, because Id-Vd characteristics of the Si nanowire FETs are affected by the band structure of the nanowire, and the band structure are very sensitive with the nanowire diameter, cross-sectional shape, crystal orientation, mechanical stress, and interface states. In this paper, recent research status of Si nanowire FETs in experimental and theoretical works are described.
  • Keywords
    CMOS integrated circuits; elemental semiconductors; field effect transistors; nanowires; semiconductor device models; silicon; Si; Si nanowire FET; Si nanowire device; Si nanowire modeling; band structure; circuit designer; crystal orientation; integrated circuit model; mechanical stress; off-leakage current; ultra-small CMOS device; CMOS integrated circuits; FETs; Logic gates; Nanoscale devices; Nanostructures; Scattering; Silicon;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Simulation of Semiconductor Processes and Devices (SISPAD), 2010 International Conference on
  • Conference_Location
    Bologna
  • ISSN
    1946-1569
  • Print_ISBN
    978-1-4244-7701-2
  • Electronic_ISBN
    1946-1569
  • Type

    conf

  • DOI
    10.1109/SISPAD.2010.5604569
  • Filename
    5604569