DocumentCode
2612084
Title
Si nanowire device and its modeling
Author
Iwai, Hiroshi ; Natori, Kenji ; Kakushima, Kuniyuki ; Ahmet, Parhat ; Oshiyama, Atsushi ; Shiraishi, Kenji ; Iwata, Jun-Ichi ; Yamada, Keisaku ; Ohmori, Kenji
Author_Institution
Frontier Res. Center, Tokyo Inst. of Technol., Yokohama, Japan
fYear
2010
fDate
6-8 Sept. 2010
Firstpage
63
Lastpage
66
Abstract
Because of its nature of effectively suppressing the off-leakage current with gate around configuration, the Si nanowire FET has been thought be the ultimate structure for for ultra-small CMOS devices towards their downsizing limit. Recently, several experimental data of Si nanowire FETs with very high on-current much larger than that of planar MOSFETs have been published. Thus, Si nanowire FETs are now drawing attention as the most promising candidate for the mainstream CMOS devices in 2020s. In order for the Si nanowire FETs to be introduced into integrated circuits, good compact models which circuit designers can easily handle with are essential. However, it is a really challenging task to establish the compact model, because Id-Vd characteristics of the Si nanowire FETs are affected by the band structure of the nanowire, and the band structure are very sensitive with the nanowire diameter, cross-sectional shape, crystal orientation, mechanical stress, and interface states. In this paper, recent research status of Si nanowire FETs in experimental and theoretical works are described.
Keywords
CMOS integrated circuits; elemental semiconductors; field effect transistors; nanowires; semiconductor device models; silicon; Si; Si nanowire FET; Si nanowire device; Si nanowire modeling; band structure; circuit designer; crystal orientation; integrated circuit model; mechanical stress; off-leakage current; ultra-small CMOS device; CMOS integrated circuits; FETs; Logic gates; Nanoscale devices; Nanostructures; Scattering; Silicon;
fLanguage
English
Publisher
ieee
Conference_Titel
Simulation of Semiconductor Processes and Devices (SISPAD), 2010 International Conference on
Conference_Location
Bologna
ISSN
1946-1569
Print_ISBN
978-1-4244-7701-2
Electronic_ISBN
1946-1569
Type
conf
DOI
10.1109/SISPAD.2010.5604569
Filename
5604569
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