• DocumentCode
    2612456
  • Title

    Electromigration-Induced Extrusions in Multi-Level Technologies

  • Author

    Lloyd, J.R.

  • Author_Institution
    IBM E. Fishkill Facility, Hopewell Junction, NY 12533
  • fYear
    1983
  • fDate
    30407
  • Firstpage
    208
  • Lastpage
    210
  • Abstract
    It has been found that wearout failure in multilevel technologies is primarily by electromigration- induced extrusions leading to intralevel short circuits rather than by the traditionally studied open-circuit mode. Recent results are reported, with a discussion of the serious implication that this newly considered failure mode generates.
  • Keywords
    Circuit testing; Condition monitoring; Conducting materials; Conductive films; Diodes; Glass; Resistors; Temperature; Thin film circuits; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Reliability Physics Symposium, 1983. 21st Annual
  • Conference_Location
    Phoenix, AZ, USA
  • ISSN
    0735-0791
  • Type

    conf

  • DOI
    10.1109/IRPS.1983.361985
  • Filename
    4208506
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2612456