DocumentCode
2613416
Title
Polyimide Adhesion Characteristics
Author
Narechania, Rajesh G. ; Bruce, James A. ; Beach, Cherje A.
Author_Institution
IBM General Technology Division, Essex Junction, VT 05452
fYear
1984
fDate
30773
Firstpage
214
Lastpage
217
Abstract
The effects of surface treatment and cure temperatures on polyimide to silicon nitride adhesion strength are discussed. Results show the importance of surface cleanliness and the requirements for an adhesion promoter. Understanding the temperature cure to a polyimide adhesion strength at a nitride interface is also important.
Keywords
Adhesives; Chemicals; Chemistry; Plasma materials processing; Plasma temperature; Polyimides; Resists; Silicon; Surface cleaning; Surface treatment;
fLanguage
English
Publisher
ieee
Conference_Titel
Reliability Physics Symposium, 1984. 22nd Annual
Conference_Location
Las Vegas, NV, USA
ISSN
0735-0791
Type
conf
DOI
10.1109/IRPS.1984.362048
Filename
4208572
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