• DocumentCode
    2614032
  • Title

    Electromigration and 1/f Noise of Aluminum Thin Films

  • Author

    Chen, T.M. ; Djeu, T.P. ; Moore, R.D.

  • Author_Institution
    Department of Electrical Engineering, University of South Florida, Tampa, Florida 33620
  • fYear
    1985
  • fDate
    31107
  • Firstpage
    87
  • Lastpage
    92
  • Abstract
    Electrical noise measurements were made for Al thin films subject to electromigration. The results were related to resistance measurements and SEM observation of the films. It was concluded that 1/f noise measurements can be used as a sensitive tool for detecting electromigration and the magnitude of noise is closely related to the time to failure of the films.
  • Keywords
    Aluminum; Circuits; Conductive films; Conductors; Current density; Electromigration; Noise measurement; Temperature; Testing; Transistors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Reliability Physics Symposium, 1985. 23rd Annual
  • Conference_Location
    Orlando, FL, USA
  • ISSN
    0735-0791
  • Type

    conf

  • DOI
    10.1109/IRPS.1985.362081
  • Filename
    4208608