DocumentCode
2614227
Title
Micro-Corrosion of Al-Cu Bonding Pads
Author
Thomas, Simon ; Berg, Howard M.
Author_Institution
Motorola, Inc., 5005 E. McDowell Road, Phoenix, AZ 85008
fYear
1985
fDate
31107
Firstpage
153
Lastpage
158
Abstract
Aluminum metallization films with copper additions are found to exhibit highly localized pitting in the presence of moisture. Galvanic action of aluminum surrounding Al2Cu theta phase particles causes localized aluminum corrosion. The thin layer of aluminum hydroxide corrosion product on the bonding pad creates an effective barrier to high quality wire bonding.
Keywords
Aluminum; Assembly; Copper; Corrosion; Integrated circuit interconnections; Metallization; Silicon; Surface topography; Wafer bonding; Wire;
fLanguage
English
Publisher
ieee
Conference_Titel
Reliability Physics Symposium, 1985. 23rd Annual
Conference_Location
Orlando, FL, USA
ISSN
0735-0791
Type
conf
DOI
10.1109/IRPS.1985.362091
Filename
4208618
Link To Document