DocumentCode
2615206
Title
Novel Failure Mechanism and Anomalous Acceleration Factor on a Beam-Lead IC
Author
Scarff, P.L. ; Iannuzzi-Glogovsky, M.
Author_Institution
AT&T Bell Laboratories, 1600 Osgood Street, North Andover, MA 01845. (617)681-6407
fYear
1987
fDate
31868
Firstpage
42
Lastpage
49
Abstract
In this paper, we identify a previously unreported corrosion mechanism as a primary cause of field failure in a particular beam-lead sealed-junction IC design. This mechanism has been reproduced under laboratory bias-humidity-temperature (BHT) test conditions. We determine an acceleration factor for this mechanism by comparing the failure distribution obtained in BHT tests with that from a field tracking study. Because a previously published reliability model for BHT aging of beam-lead ICs grossly overestimates this observed acceleration factor, it appears that this model does not adequately describe the corrosion mechanism discussed in this paper.
Keywords
Accelerated aging; Acceleration; Bipolar integrated circuits; Corrosion; Failure analysis; Hybrid integrated circuits; Kinetic theory; Laboratories; Life estimation; Testing;
fLanguage
English
Publisher
ieee
Conference_Titel
Reliability Physics Symposium, 1987. 25th Annual
Conference_Location
San Diego, CA, USA
ISSN
0735-0791
Type
conf
DOI
10.1109/IRPS.1987.362153
Filename
4208687
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