• DocumentCode
    2615307
  • Title

    Manufacturing AlGaAs/GaAs HBTs on 100 mm wafers

  • Author

    Huang, R.-T. ; Nelson, D. ; Mony, S. ; Tang, R. ; Pierson, R. ; Penney, J. ; Sahai, R.

  • Author_Institution
    Rockwell Int. Corp., Newbury Park, CA, USA
  • fYear
    1993
  • fDate
    10-13 Oct. 1993
  • Firstpage
    345
  • Lastpage
    348
  • Abstract
    The authors report the first implementation of HBT technology on 100 mm OMVPE-grown epitaxial wafers. The electronic characteristics of large area HBT devices with an emitter size of 67/spl times/67 /spl mu/m/sup 2/ are used to measure the uniformity of the epitaxial material. The variations of current gain and V/sub be/ turn-on voltage for such devices are less than 3% and 1%, respectively, across a wafer. This indicates that the characteristic uniformity of epitaxial films grown on 100 mm wafers is comparable with films grown on three-inch wafers. Process induced variation in the device characteristics is measured on small area devices with an emitter size of 1.4/spl times/3 /spl mu/m/sup 2/. The across wafer variations of current gain and V/sub be/ turn-on voltage for these devices are less than 10% and 1%. Circuit yield sufficient for production ramp-up has been demonstrated for gain blocks, prescalers, 14-bit digital-to-analog converters and 8-bit analog-to-digital converters. The success over this array of products demonstrates that the OMVPE-grown 100 mm epitaxial wafers and the HBT fabrication process developed are well suited for a production environment.<>
  • Keywords
    III-V semiconductors; aluminium compounds; analogue-digital conversion; bipolar analogue integrated circuits; bipolar logic circuits; digital-analogue conversion; gallium arsenide; heterojunction bipolar transistors; integrated circuit technology; integrated circuit yield; isolation technology; logic arrays; prescalers; semiconductor epitaxial layers; semiconductor growth; vapour phase epitaxial growth; wafer-scale integration; 100 mm; AlGaAs-GaAs; HBT fabrication process; III-V semiconductor; OMVPE-grown epitaxial wafers; analog IC; analog-to-digital converters; characteristic uniformity; circuit yield; current gain; digital IC; digital-to-analog converters; gain blocks; gate arrays; isolation; large area; prescalers; process induced variation; production environment; turn-on voltage; uniformity; Analog-digital conversion; Area measurement; Circuits; Digital-analog conversion; Gallium arsenide; Heterojunction bipolar transistors; Manufacturing; Production; Size measurement; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Gallium Arsenide Integrated Circuit (GaAs IC) Symposium, 1993. Technical Digest 1993., 15th Annual
  • Conference_Location
    San Jose, CA, USA
  • Print_ISBN
    0-7803-1393-3
  • Type

    conf

  • DOI
    10.1109/GAAS.1993.394437
  • Filename
    394437