DocumentCode
2617071
Title
Package measurement methodology using a surface mount jig
Author
Luk, Timwah ; Hosseini, Mahdi
fYear
1993
fDate
20-22 Oct 1993
Firstpage
155
Lastpage
158
Abstract
Scattering-parameter, time domain reflectometry, and low frequency LCR measurement techniques, and the design of a universal jig for these measurements are described. This jig minimizes parasitics associated with the measurements, and provides a uniform ground plane. The advantages of using this universal jig for the above measurements are discussed, and measurement examples for specific measurement types are provided
Keywords
Contacts; Electrical resistance measurement; Frequency measurement; Integrated circuit measurements; Integrated circuit packaging; Measurement techniques; Pins; Reflectometry; Semiconductor device packaging; Time measurement;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Performance of Electronic Packaging, 1993
Conference_Location
Monterey, CA
Print_ISBN
0-7803-1427-1
Type
conf
DOI
10.1109/EPEP.1993.394566
Filename
394566
Link To Document