Spectral domain quasi-TEM computation of the propagation characteristics of single and coupled interconnects with meshed ground planes

Author

Luo, S. ; Jong, J.M. ; Tripathi, V.K.

Author_Institution

Dept. of Electr. & Comput. Eng., Oregon State Univ., Corvallis, OR, USA

fYear

1993

fDate

20-22 Oct 1993

Firstpage

128

Lastpage

130

Abstract

The impedances, wave velocities and crosstalk coupling coefficients for interconnects with rectangular meshed ground planes are calculated by using the quasi-transverse electromagnetic wave (TEM) spectral domain technique. The impedance calculated are compared with measured data as a function of the mesh size and the trace position and direction with respect to the mesh plane orientation

Keywords

crosstalk; electromagnetic wave propagation; integrated circuit interconnections; integrated circuit packaging; mesh generation; multichip modules; spectral-domain analysis; MCM; coupled interconnects; crosstalk coupling coefficients; impedances; mesh plane orientation; mesh size; multilayer electronic package; propagation characteristics; quasi-TEM spectral domain technique; rectangular meshed ground planes; single interconnects; transverse electromagnetic wave; wave velocities; Apertures; Dielectric constant; Dielectric measurements; Impedance measurement; Packaging; Position measurement; Semiconductor device measurement; Size measurement; Thermal management; Transmission lines;

fLanguage

English

Publisher

ieee

Conference_Titel

Electrical Performance of Electronic Packaging, 1993

Conference_Location

Monterey, CA

Print_ISBN

0-7803-1427-1

Type

conf

DOI

10.1109/EPEP.1993.394573

Filename

394573