DocumentCode
2617595
Title
Package requirements for high performance VLSI CMOS chips
Author
Davidson, Evan
Author_Institution
IBM Corp., Poughkeepsie, NY, USA
fYear
1993
fDate
20-22 Oct 1993
Firstpage
3
Lastpage
4
Abstract
There is a set of unique characteristics that can make the choice of package attributes even more critical for CMOS than when designing with a bipolar or GaAs technology. The CMOS packaging concerns are caused by features that make it a desirable technology choice for high performance systems. They are: switching speed, high density, and no DC power. These items can drive the need for a package definition that requires all of the complexity and cost of the kinds of packaging normally thought of for mainframes and supercomputers
Keywords
CMOS integrated circuits; VLSI; integrated circuit packaging; CMOS packaging; GaAs technology; VLSI CMOS chips; bipolar technology; high performance systems; mainframes; packaging requirements; supercomputers; switching speed; CMOS technology; Circuits; Clocks; Costs; Crosstalk; Delay; Gallium arsenide; Packaging machines; Supercomputers; Very large scale integration;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Performance of Electronic Packaging, 1993
Conference_Location
Monterey, CA
Print_ISBN
0-7803-1427-1
Type
conf
DOI
10.1109/EPEP.1993.394605
Filename
394605
Link To Document