DocumentCode
2617623
Title
Proceedings of IEEE Electrical Performance of Electronic Packaging
fYear
1993
fDate
20-22 Oct. 1993
Abstract
The following topics are dealt with: system design; microwave packaging; electromagnetic modeling and parameter extraction; automated package design; measurements; modeling; packaging for communications; simulation; and characterization
Keywords
circuit CAD; circuit analysis computing; microwave circuits; packaging; automated package design; electromagnetic modeling; measurements; microwave packaging; packaging for communications; parameter extraction; simulation; system design;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Performance of Electronic Packaging, 1993
Conference_Location
Monterey, CA, USA
Print_ISBN
0-7803-1427-1
Type
conf
DOI
10.1109/EPEP.1993.394606
Filename
394606
Link To Document