• DocumentCode
    2619559
  • Title

    Electro-mechanical Impedance Modeling for Health Monitoring of a Damaged Thin Plate

  • Author

    Zhang, Yuxiang ; Xu, Fuhou ; Zhang, Tongda ; Ma, Liuyi ; Wu, Cuiqin

  • Author_Institution
    Xi´´an Res. Inst. of Hi-Tech., Xi´´an, China
  • Volume
    2
  • fYear
    2011
  • fDate
    6-7 Jan. 2011
  • Firstpage
    22
  • Lastpage
    28
  • Abstract
    This paper presents an electro-mechanical impedance (EMI) model for damage identification of thin plate structures. Firstly, a damaged thin plate with a pair of piezoceramic (PZT) transducers bonded on the opposite sides is considered. And the pure bending vibration of the plate actuated by the PZT patches is analyzed. Then, a method which combines the p-Ritz method and the matrix perturbation method is proposed to obtain the approximate analytic relation between the mechanical impedance of the damaged plate and the physical parameters of damage. Based on the interaction model between the PZT and the plate, an analytic relation between the admittance of PZT and the physical parameters of damage can be derived. Finally, numerical examples are used to verify the validity and feasibility of the proposed EMI model. The results indicate that the EMI model is more applicable for the thin plate structures with small damage.
  • Keywords
    condition monitoring; matrix algebra; piezoelectric transducers; plates (structures); vibrations; EMI model; PZT transducer; bending vibration; damage identification; damaged thin plate; electro-mechanical impedance modeling; health monitoring; matrix perturbation method; p-Ritz method; piezoceramic transducer; Admittance; Analytical models; Eigenvalues and eigenfunctions; Electromagnetic interference; Finite element methods; Impedance; Transducers; PZT; damage; electro-mechanical impedance; p-Ritz; plate structures; structural health monitoring;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Measuring Technology and Mechatronics Automation (ICMTMA), 2011 Third International Conference on
  • Conference_Location
    Shangshai
  • Print_ISBN
    978-1-4244-9010-3
  • Type

    conf

  • DOI
    10.1109/ICMTMA.2011.293
  • Filename
    5721007