DocumentCode
2621139
Title
Modeling of printed circuit cards subject to vibration
Author
Pitarresi, James Mark
Author_Institution
Dept. of Mech. & Ind. Eng., State Univ. of New York, Binghamton, NY, USA
fYear
1990
fDate
1-3 May 1990
Firstpage
2104
Abstract
Some of the current methodologies used in modeling printed circuit cards subjected to vibration are introduced. An overview of experimental and computational methods of determining the natural frequencies and mode shapes of circuit cards populated with various module types is presented. Methodologies for correlating experimentally derived vibration data with the computer models are explored. By using the modal assurance criterion as a correlation measure, it is shown that smearing or homogenizing the material properties is effective in preserving a good degree of correlation in the lower modes of vibration of an example printed circuit card. It is also observed that modeling the entire card as a single composite modeling region is surprisingly effective. However, increasing the number of composite modeling regions to five produced a better overall correlation of the modes of interest
Keywords
electronic engineering computing; finite element analysis; printed circuits; vibrations; computer models; correlation; finite element modelling; homogenizing; modal assurance criterion; mode shapes; modeling; natural frequencies; printed circuit cards; reliability; smearing; vibration; Acceleration; Damping; Electric shock; Electronic packaging thermal management; Electronics industry; Printed circuits; Shape; Surface-mount technology; Transmission line matrix methods; Vibrations;
fLanguage
English
Publisher
ieee
Conference_Titel
Circuits and Systems, 1990., IEEE International Symposium on
Conference_Location
New Orleans, LA
Type
conf
DOI
10.1109/ISCAS.1990.112213
Filename
112213
Link To Document