• DocumentCode
    262174
  • Title

    10.3 heterogeneous multi-processing quad-core CPU and dual-GPU design for optimal performance, power, and thermal tradeoffs in a 28nm mobile application processor

  • Author

    Wang, Aiping ; Tsung-Yao Lin ; Shichin Ouyang ; Wei-Hung Huang ; Jidong Wang ; Shu-Hsin Chang ; Sheng-Ping Chen ; Chun-Hsiung Hu ; Tai, Jim C. ; Koan-Sin Tan ; Meng-Nan Tsou ; Ming-Hsien Lee ; Gammie, Gordon ; Chi-Wei Yang ; Chih-Chieh Yang ; Yeh-Chi Chou

  • Author_Institution
    MediaTek, Austin, TX, USA
  • fYear
    2014
  • fDate
    9-13 Feb. 2014
  • Firstpage
    180
  • Lastpage
    181
  • Abstract
    Driven by consumer demand, mobile devices such as smartphones and tablets are offering more desktop-like capabilities. High-performance CPUs and GPUs, which handle compute-intensive tasks, are key to enhancing the user experience in applications such as 3D gaming, high-definition video and internet browsing. A CPU and GPU on a tablet device, however, can together consume up to 90% of the total SoC power. As the number of CPU and GPU cores on mobile devices continues to grow, it will require innovation to keep within fixed power and thermal budgets, while providing high performance.
  • Keywords
    graphics processing units; microprocessor chips; multiprocessing systems; smart phones; system-on-chip; 3D gaming; Internet browsing; SoC; dual-GPU design; heterogeneous multiprocessing quad-core CPU; high-definition video; mobile application processor; mobile devices; power budget; size 28 nm; smartphones; system-on-chip; tablet device; thermal budget; Clocks; Graphics processing units; Performance evaluation; System-on-chip; Temperature measurement; Temperature sensors; Thermal management;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State Circuits Conference Digest of Technical Papers (ISSCC), 2014 IEEE International
  • Conference_Location
    San Francisco, CA
  • ISSN
    0193-6530
  • Print_ISBN
    978-1-4799-0918-6
  • Type

    conf

  • DOI
    10.1109/ISSCC.2014.6757390
  • Filename
    6757390