• DocumentCode
    262221
  • Title

    12.2 3D gesture-sensing system for interactive displays based on extended-range capacitive sensing

  • Author

    Yingzhe Hu ; Liechao Huang ; Rieutort-Louis, Warren ; Sanz-Robinson, Josue ; Wagner, Steffen ; Sturm, James C. ; Verma, Naveen

  • Author_Institution
    Princeton Univ., Princeton, NJ, USA
  • fYear
    2014
  • fDate
    9-13 Feb. 2014
  • Firstpage
    212
  • Lastpage
    213
  • Abstract
    Capacitive touch screens have enabled compelling interfaces for displays. Three-dimensional (3D) sensing, where user gestures can also be sensed in the out-of-plane dimension to distances of 20 to 30cm, represents new interfacing possibilities that could substantially enrich user experience. The challenge is achieving sensitivity at these distances when sensing the small capacitive perturbations caused by user interaction with sensing electrodes. Among capacitive-sensing approaches, self capacitance enables substantially greater distance than mutual capacitance (i.e., between electrodes), but can suffer from ghost effects during multi-touch. For gesture recognition, however, processing via classifiers can overcome such effects, enabling a rich dictionary of gestures. Nonetheless, the sensing distance of such systems has been too limited for 3D sensing.
  • Keywords
    capacitance measurement; capacitive sensors; electrodes; gesture recognition; image classification; image sensors; interactive devices; tactile sensors; three-dimensional displays; touch sensitive screens; 3D gesture-sensing system; capacitive perturbation; capacitive touch screen; dictionary; distance 20 cm to 30 cm; electrode; extended-range capacitive sensing; gesture recognition; interactive display; mutual capacitance; three-dimensional gesture-sensing system; Capacitance; Couplings; Electrodes; Noise; Sensitivity; Sensors; Three-dimensional displays;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State Circuits Conference Digest of Technical Papers (ISSCC), 2014 IEEE International
  • Conference_Location
    San Francisco, CA
  • ISSN
    0193-6530
  • Print_ISBN
    978-1-4799-0918-6
  • Type

    conf

  • DOI
    10.1109/ISSCC.2014.6757404
  • Filename
    6757404