DocumentCode
2623179
Title
The WASP demonstrator programme: the engineering of a wafer-scale system
Author
Jalowiecki, I.P. ; Hedge, S.J.
Author_Institution
Aspex Microsyst. Ltd., Brunel Univ., Uxbridge, UK
fYear
1990
fDate
23-25 Jan 1990
Firstpage
43
Lastpage
49
Abstract
The aim of the Brunel University/Aspex Microsystems WASP (WSI Associative String Processor) project is the production of high performance, cost-effective, practical monolithic Wafer-Scale Parallel Processing systems. The Associative String Processor (ASP) architecture is a massively parallel, fine-grain architecture, suitable for VLSI, ULSI and WSI fabrication. Following a considerable period of test chip experimentation, addressing fundamental WSI design issues, this work graduated to a programme of first technology, and then functional demonstrators. Designed to progress towards a practical WASP in a series of carefully planned steps, these devices prove the feasibility of the WASP architecture and provide engineering data and proof of principle unobtainable by any other means. The authors summarise the demonstrator programme to date, including the test results from the first technology demonstrator (WASP 1) and the architecture of the second technology demonstrator (WASP 2)
Keywords
VLSI; cellular arrays; integrated circuit technology; microprocessor chips; parallel architectures; Aspex Microsystems; Associative String Processor; Brunel University; WASP demonstrator programme; WSI Associative String Processor; Wafer-Scale Parallel Processing systems; demonstrator programme; engineering data; fine-grain architecture; proof of principle; test chip experimentation; test results; wafer-scale system; Application specific processors; Communication system control; Contracts; Decoding; Design engineering; Parallel processing; Production systems; Testing; Ultra large scale integration; Very large scale integration;
fLanguage
English
Publisher
ieee
Conference_Titel
Wafer Scale Integration, 1990. Proceedings., [2nd] International Conference on
Conference_Location
San Francisco, CA
Print_ISBN
0-8186-9013-5
Type
conf
DOI
10.1109/ICWSI.1990.63881
Filename
63881
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