• DocumentCode
    262319
  • Title

    17.5 A 0.07mm2 2-channel instrumentation amplifier with 0.1% gain matching in 0.16μm CMOS

  • Author

    Sebastiano, Fabio ; Butti, Federico ; van Veldhoven, Robert ; Bruschi, P.

  • Author_Institution
    NXP Semicond., Eindhoven, Netherlands
  • fYear
    2014
  • fDate
    9-13 Feb. 2014
  • Firstpage
    294
  • Lastpage
    295
  • Abstract
    Extremely small-area sensor front-ends are required for cost-constrained automotive applications. Instrumentation amplifiers (IA) for such front-ends must process multi-channel sensor outputs and provide gain matching over the channels for proper sensor operation. Angular sensors are a typical example, in which the sine and cosine outputs of a resistive magnetic sensor must be processed with adequate gain matching to avoid unacceptable angular errors. This paper presents a 2-channel instrumentation amplifier in 0.16μm CMOS with 0.1% gain matching and occupying 0.035mm2 per channel. This represents a 13.3× area improvement with respect to state-of-the-art designs with similar gain accuracy [1]-[4], while maintaining low noise (18.7nV/√Hz), low offset (17μV) and high power efficiency (NEF=12.9). The accurate gain matching in a limited area is enabled by the adoption of a dynamic element matching (DEM) scheme and by the use of a high chopping frequency.
  • Keywords
    CMOS integrated circuits; instrumentation amplifiers; 2-channel instrumentation amplifier; CMOS; DEM scheme; IA; angular sensors; cosine outputs; cost-constrained automotive applications; dynamic element matching scheme; gain matching; high chopping frequency; multichannel sensor outputs; resistive magnetic sensor; sensor front-ends; sensor operation; size 0.16 mum; voltage 17 muV; Accuracy; CMOS integrated circuits; Gain measurement; Instruments; Noise measurement; Solid state circuits; Switches;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State Circuits Conference Digest of Technical Papers (ISSCC), 2014 IEEE International
  • Conference_Location
    San Francisco, CA
  • ISSN
    0193-6530
  • Print_ISBN
    978-1-4799-0918-6
  • Type

    conf

  • DOI
    10.1109/ISSCC.2014.6757440
  • Filename
    6757440