• DocumentCode
    2623254
  • Title

    Experimental validation of numerical models for packaged MTL networks in non-plane wave external fields

  • Author

    Lapohos, Tibor ; LoVetri, Joe ; Seregelyi, Joe ; Somons, N.

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Univ. of Western Ontario, London, Ont., Canada
  • Volume
    2
  • fYear
    1998
  • fDate
    24-28 Aug 1998
  • Firstpage
    969
  • Abstract
    Results are presented of recent efforts to develop and experimentally validate numerical algorithms for analysing the coupling of electromagnetic energy into printed circuit boards (PCBs). In the experiments, the PCBs contain multiconductor transmission lines (MTLs) and are placed in a perfect electric conductor (PEC) enclosure. Both full-field models, using the finite difference time domain (FDTD) and transmission line matrix (TLM) methods, as well as quasi-TEM models, using the MTL equations with forcing function terms, are investigated. Various test cases are considered in which a radiating monopole and a PCB, containing a microstrip, as the susceptible circuit, are placed inside a perfectly conducting box. Comparisons with experiment are made by first obtaining the numerically calculated response, at the near-end and far-end of the microstrip line resulting from the impulse excitation of the monopole. The experimental excitation pulse is then convolved with each of these responses to obtain a more accurate estimate of the induced voltage. As would be expected, the quasi-TEM approach requires considerably less computational resources but produces less reliable results for the complicated field distributions existing around the packaged PCB. Nevertheless the quasi-TEM approach has the advantage of being more easily interfaced with circuit simulators. This would be necessary if a complete circuit board were to be simulated
  • Keywords
    electromagnetic fields; finite difference time-domain analysis; multiconductor transmission lines; numerical analysis; printed circuits; transmission line matrix methods; MTL equations; circuit simulators; complicated field distributions; electromagnetic energy coupling; finite difference time domain method; forcing function terms; full-field models; impulse excitation; microstrip; microstrip line; multiconductor transmission lines; perfect electric conductor enclosure; perfectly conducting box; printed circuit boards; quasi-TEM approach; quasi-TEM models; radiating monopole; susceptible circuit; transmission line matrix method; Circuit testing; Computational modeling; Electromagnetic coupling; Finite difference methods; Microstrip; Multiconductor transmission lines; Numerical models; Packaging; Printed circuits; Transmission line matrix methods;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electromagnetic Compatibility, 1998. 1998 IEEE International Symposium on
  • Conference_Location
    Denver, CO
  • Print_ISBN
    0-7803-5015-4
  • Type

    conf

  • DOI
    10.1109/ISEMC.1998.750339
  • Filename
    750339