• DocumentCode
    262837
  • Title

    Counterfeit IC detection using light emission

  • Author

    Peilin Song ; Stellari, Franco ; Weger, Alan

  • Author_Institution
    IBM T. J. Watson Res. Center, Yorktown Heights, NY, USA
  • fYear
    2014
  • fDate
    20-23 Oct. 2014
  • Firstpage
    1
  • Lastpage
    8
  • Abstract
    The proliferation of counterfeit Integrated Circuits (ICs) poses a big challenge for the electronics industry as today´s supply chain of ICs becomes more complex and expensive. For this reason, it is imperative to mitigate these risks by developing counterfeit IC detection techniques, especially at the chip level. In this paper, a novel counterfeit IC detection method is proposed. It is based on the measurement of intrinsic light emission from CMOS ICs that is a strong function of the device threshold voltage (Vt) for a given technology. In contrast to currently available counterfeit IC detection techniques, the proposed method measures IC degradation after it has been used for a long time and does not require a reference IC to provide a baseline signature. A differential technique is used to detect different levels of degradation inside the same chip in order to determine if it is counterfeit. Experimental results presented in this paper show that emission can be effectively used to detect degradation, thus making this technique a very effective way to detect counterfeit ICs.
  • Keywords
    CMOS integrated circuits; counterfeit goods; fraud; integrated circuit manufacture; integrated circuit testing; light emitting devices; supply chain management; CMOS IC; IC degradation; baseline signature; chip level; counterfeit IC detection techniques; counterfeit integrated circuits; degradation detection; device threshold voltage; differential technique; electronics industry; intrinsic light emission measurement; risks mitigation; supply chain; Abstracts; Circuit analysis; Decision support systems; Heating; Industries; Stress;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Test Conference (ITC), 2014 IEEE International
  • Conference_Location
    Seattle, WA
  • Type

    conf

  • DOI
    10.1109/TEST.2014.7035356
  • Filename
    7035356