DocumentCode
2628566
Title
Effect of mixed-reference planes on single-ended and differential links in multilayer substrates
Author
Müller, Sebastian ; Rimolo-Donadio, Renato ; Kotzev, Miroslav ; Brüns, Heinz-Dietrich ; Schuster, Christian
Author_Institution
Inst. fur Theor. Elektrotechnik, Tech. Univ. Hamburg, Harburg, Germany
fYear
2010
fDate
9-12 May 2010
Firstpage
27
Lastpage
30
Abstract
In this paper, efficient physics-based models are used to examine diverse differential and single-ended link configurations on multilayer substrates with mixed reference planes (i.e. links running between ground and power planes). The effect of different plane assignments is studied and the results are validated with a general purpose full-wave solver. It is shown that the plane configuration affects mainly the coupling into the parallel-plate mode, and it could be either a broadband or narrowband effect depending on the link environment. Although the effect of ground vias can be appreciated with any plane configuration, the utilization of more ground planes helps to reduce the equivalent parallel-plate impedance and therefore to decrease the amount of energy coupled between the reference planes. A reduction of up to 1.8 dB of the transmission and an increase of more than 10 dB of the crosstalk could be observed at specific frequencies when the assignment of a single reference plane was changed from ground to power.
Keywords
integrated circuit interconnections; substrates; broadband effect; differential links; general purpose full-wave solver; ground vias; mixed-reference planes; multilayer substrates; narrowband effect; parallel-plate mode; physics-based models; plane configuration; single-ended links; Conductors; Couplings; Crosstalk; Impedance; Joining processes; Multiconductor transmission lines; Narrowband; Nonhomogeneous media; Power system interconnection; Transmission line matrix methods;
fLanguage
English
Publisher
ieee
Conference_Titel
Signal Propagation on Interconnects (SPI), 2010 IEEE 14th Workshop on
Conference_Location
Hildesheim
Print_ISBN
978-1-4244-7611-4
Type
conf
DOI
10.1109/SPI.2010.5483587
Filename
5483587
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