• DocumentCode
    2628566
  • Title

    Effect of mixed-reference planes on single-ended and differential links in multilayer substrates

  • Author

    Müller, Sebastian ; Rimolo-Donadio, Renato ; Kotzev, Miroslav ; Brüns, Heinz-Dietrich ; Schuster, Christian

  • Author_Institution
    Inst. fur Theor. Elektrotechnik, Tech. Univ. Hamburg, Harburg, Germany
  • fYear
    2010
  • fDate
    9-12 May 2010
  • Firstpage
    27
  • Lastpage
    30
  • Abstract
    In this paper, efficient physics-based models are used to examine diverse differential and single-ended link configurations on multilayer substrates with mixed reference planes (i.e. links running between ground and power planes). The effect of different plane assignments is studied and the results are validated with a general purpose full-wave solver. It is shown that the plane configuration affects mainly the coupling into the parallel-plate mode, and it could be either a broadband or narrowband effect depending on the link environment. Although the effect of ground vias can be appreciated with any plane configuration, the utilization of more ground planes helps to reduce the equivalent parallel-plate impedance and therefore to decrease the amount of energy coupled between the reference planes. A reduction of up to 1.8 dB of the transmission and an increase of more than 10 dB of the crosstalk could be observed at specific frequencies when the assignment of a single reference plane was changed from ground to power.
  • Keywords
    integrated circuit interconnections; substrates; broadband effect; differential links; general purpose full-wave solver; ground vias; mixed-reference planes; multilayer substrates; narrowband effect; parallel-plate mode; physics-based models; plane configuration; single-ended links; Conductors; Couplings; Crosstalk; Impedance; Joining processes; Multiconductor transmission lines; Narrowband; Nonhomogeneous media; Power system interconnection; Transmission line matrix methods;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Signal Propagation on Interconnects (SPI), 2010 IEEE 14th Workshop on
  • Conference_Location
    Hildesheim
  • Print_ISBN
    978-1-4244-7611-4
  • Type

    conf

  • DOI
    10.1109/SPI.2010.5483587
  • Filename
    5483587