Mathematical model of high voltage sandwich bus duct

Author

Ramnani, Vishal ; Parekh, Mrunal ; Dholakiya, Vihang ; Buch, Gaurang

Author_Institution

Dept. of Electr., Nirma Univ., Ahemdabad, India

fYear

2014

fDate

8-11 Sept. 2014

Firstpage

1

Lastpage

4

Abstract

Bus duct technology is widely used due to its compactness and high current carrying capacity. Sandwich bus duct is energy efficient and compact technology in LT (Low Tension) systems. This paper aims the mathematical modeling of HT (High Tension) bus duct for 7.2 kV system and the comparison of voltage drop and power loss in HV (High Voltage) sandwich Bus duct and in conventional Air insulated phase bus duct (AIPBD). Maximum potential gradient and magnetic flux density is calculated using finite element method (FEM) approach, through which capacitance and inductance matrix are derived which leads to mathematical model of HV sandwich bus duct. Effect of Mutual inductance on voltage drop and power loss is shown. A commercial finite element code Maxwell 2D/3D and Ansoft Simplorer is used for prototype sandwich bus duct design.

Keywords

Maxwell equations; capacitance; ducts; electric potential; finite element analysis; high-voltage techniques; inductance; losses; magnetic flux; matrix algebra; 2D Maxwell; 3D Maxwell; AIPBD; Ansoft Simplorer; FEM approach; HT bus duct; LT systems; air insulated phase bus duct; capacitance matrix; compact technology; energy efficient technology; finite element code; finite element method; high current carrying capacity; high voltage sandwich bus duct; inductance matrix; magnetic flux density; mathematical modeling; maximum potential gradient; mutual inductance; power loss; voltage 7.2 kV; voltage drop; Capacitance; Ducts; Eddy currents; Electric fields; Finite element analysis; Inductance; Mathematical model; AIPBD; Bus Duct system (BDS); EM (Electro magnetic) loss; Mutual inductance; skin effect and proximity effect;

fLanguage

English

Publisher

ieee

Conference_Titel

High Voltage Engineering and Application (ICHVE), 2014 International Conference on

Conference_Location

Poznan

Type

conf

DOI

10.1109/ICHVE.2014.7035409

Filename

7035409